RAD Studio 10.2 Opens Up Linux Deployment and Multi-tenancy Support for RAD Server

Application development software provider Embarcadero Technologies has released RAD Studio 10.2, providing users with Linux support, improved quality and scalability, and multi-tenancy support for RAD Server.

Have the ability to take new and existing Windows server applications, using the new Delphi Linux compiler, to target Linux servers that are more affordable. With Linux support RAD Studio developers can cross-compile across various platforms, such as Linux, Windows, Android, iOS, and macOS – with the security and speed associated with compiled applications.

With this release, Embarcadero Technologies are helping customers to “reduce server costs by easily recompiling their existing Windows server applications for Linux, producing fast and secure native binaries”, states Embarcadero RAD Studio Product Manager, Marco Cantu.

Other improvements in the RAD Studio 10.2 update includes:

• Improved compiled C++ performance, debugging and large memory support for the linker within C++ Builder.

•  Support for MariaDB, the popular fork of MySQL, which is widely used on Linux, in addition to design time data modification editors, enabling users to deeply embedded data to speed up application prototyping on FireDAC (the Embarcadero high-performance data access library).

• Through enhancing the image management with integrated multi-threading support, new styles for macOS and Android wear, built-in support for changing the status bar color on iOS and more, Embarcadero has simplified the challenges of cross platform UI development with FireMonkey (the cross platform GUI framework).

• Improvements to the RAD Studio 10.2’s View menu – users can now view project files through a new right-click menu option within the “Project Manager” and “Code Editor” tabs, plus take advantage of improved high DPI support and better large project group support.

To find out more about the release, please contact our Embarcadero team on +44(0) 1364 655123.